Thinner packaging

The thickness of the encapsulation layer is further reduced, which can completely solve the stubborn problem of colored and dark lines between the formal COB modules.

Larger viewing angle

It has good viewing angle and side view display uniformity, no color cast under large viewing angles, and can achieve a viewing effect of nearly 180 degrees.

Lower point spacing

Inverted COB does not require wiring, and its physical space size is only limited by the size of the light-emitting chip. It breaks through the point spacing limit of the regular chip and is the preferred choice for products with a point spacing of 1.0 or less.

Power consumption reduction

The fully inverted light-emitting chip reduces power consumption by 50% under the same brightness conditions. Unique heat dissipation technology, under the same brightness, the surface temperature of the screen is 10 ℃ lower than that of conventional LED display screens, making it more suitable for near screen experience applications.

Higher reliability

Simplified production process, better display effect, perfect near screen experience, and the ability to achieve true chip level spacing.